About this position
TNO is the Netherlands Organisation for Applied Scientific Research. As an independent research institute, TNO connects science and industry to accelerate innovation and translate knowledge into practical, scalable solutions. Within the semiconductor sector, TNO plays a leading role in the development of advanced chip packaging technologies through the Chip Integration Technology Center (CITC). The back‑end laboratory in Nijmegen is equipped with state‑of‑the‑art packaging and assembly equipment, where this role supports the development of advanced die‑attach and assembly technologies to improve the performance and reliability of power electronics.
What will be your role?
You will act as a Senior Process Engineer, working at the intersection of packaging design, process development, materials science and semiconductor assembly technologies. You will be involved in the entire development cycle of advanced die‑attach solutions and new packages for power electronics, from design and realization to experimental validation and characterization. Your work includes collaborating with industrial partners and customers, leading design and experimental work on multiple projects, and contributing to a multidisciplinary and international team.
- Define and optimize assembly processes and production flows for new die‑attach technologies, including processes for thin die assembly (≤50 µm).
- Design packages and packaging components for power electronics (e.g., lead frames and clips).
- Design tooling for packaging manufacturing and assembly, such as lead‑frame tooling, vacuum pick‑up tools and other product‑specific fixtures.
- Set up, execute and analyse Design of Experiments (DoE) for materials and process development.
- Analyse experimental results and translate findings into process improvements and technological recommendations.
- Program and operate advanced packaging and assembly equipment.
- Report technical progress and results to customers and project stakeholders.
- Provide technical supervision to students and junior engineers.
- Minimum 8years of experience in semiconductor packaging development.
- Extensive knowledge of semiconductor assembly and packaging technologies.
- Experience with packaging and tooling design using 2D and 3D design software such as AutoCAD and/or SolidWorks.
- Proven experience with DoE methodologies, data analysis and experimental process development.
- Experience with advanced assembly, die‑attach and interconnection technologies.
- Knowledge of Ag and Cu sintering processes is highly desirable.
- Hands‑on mentality and the ability to independently plan and execute technical work.
- Strong communication skills and the ability to present technical results in English to industrial customers and partners.
- Gross monthly salary commensurate with knowledge and experience.
- 8% holiday pay, a 13th‑month bonus of 8.33% and a flex budget (5.58% + €180).
- Compelling professional, innovative working environment with access to advanced technology and opportunities to shape your career.
- Annual leave: 33 days plus a flexible holiday day that can be used for cultural, religious or other important reasons.
- Flexible working hours, the possibility to work part‑time (32 or 36 hours) and the possibility of working from home.
- Comprehensive mobility plan including full compensation for public transportation for commuting and business travel.
- Extensive relocation package for international candidates.
- Good pension scheme.
- Optional employee benefits that can be tailored to personal needs.
€7000 - €9500 monthly