An exciting opportunity for a Process Engineer to join a growing high-technology manufacturing team, supporting the development and introduction of advanced RF and microwave products into production.
The role will focus on developing and optimising semiconductor and RF assembly processes, particularly die attach and gold wire bonding, while driving yield, quality and process improvements.
Key Responsibilities
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Develop and optimise die attach and wire bonding processes
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Support NPI, DFM/DFA and process validation
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Improve manufacturing yield, reliability and efficiency
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Carry out process trials, root cause analysis and continuous improvement
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Develop and document manufacturing processes and control plans
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Work closely with Engineering, Quality and Production teams
Requirements
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Degree in Engineering, Materials Science, Physics or similar
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Experience in semiconductor, RF, electronics or high-precision manufacturing
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Hands-on experience with silver epoxy, silver sinter, eutectic die attach or gold wire bonding
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Strong understanding of manufacturing processes and statistical analysis
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Excellent problem-solving skills and a hands-on approach
Experience in automotive electronics, power electronics, RF manufacturing or contract manufacturing would be highly desirable.
Apply now
Salary description
£60000.00 - £65000.00 per year