Jobs in Dalton le Dale

Wolviston Management Services is supporting our amazing client in the recruitment of a Process Engineer to join their growing team.
Due to continued growth and investment in advanced packaging and assembly capability, they are expanding their Process Engineering function to support the transition of new technologies into stable, high-yield manufacturing.
The Role
This position will focus on the development, optimisation and control of advanced semiconductor module assembly processes, with a particular emphasis on die attach and wire/ribbon bonding technologies.
The successful candidate will play a key role in bridging development and production, ensuring processes are robust, scalable and capable of supporting future technology requirements.
Key Responsibilities Technology & Roadmap Development
Collaborate with Engineering to identify and mature manufacturing technologies aligned to future product requirements
Evaluate emerging assembly and interconnect technologies to support increased power density and frequency performance
Assess manufacturability, scalability and cost implications of new technologies
Lead feasibility trials and proof-of-concept activities
Support supplier evaluation and make/buy decisions Die Attach Process Engineering
Develop and optimise processes including silver epoxy, silver sinter and eutectic attach (AuSn)
Define process parameters (temperature, pressure, time and atmosphere)
Deliver process validation, qualification and reliability testing
Characterise bond performance including voiding, bond line thickness and thermal resistance
Support material selection and supplier development Wire Bonding Development
Establish and optimise gold wire and ribbon bonding processes (ball and wedge)
Define process parameters across varying substrates and metallisation types
Perform mechanical testing (pull/shear) and reliability assessments
Resolve bonding challenges including intermetallic formation and pad integrity
Support fine-pitch and high-frequency assembly requirements Manufacturing & Continuous Improvement
Define, document and control manufacturing processes and workflows
Develop SOPs, control plans and process documentation
Monitor process capability (SPC, Cp/Cpk) and drive yield improvements
Lead root cause investigations using structured methodologies (8D, DMAIC, FMEA)
Deliver continuous improvement initiatives targeting cost, quality and cycle time New Product Introduction (NPI)
Support DFM/DFA activities during product development
Develop pilot builds and process validation strategies
Work cross-functionally to ensure smooth transition into production
Define tooling, fixturing and automation requirements Requirements Essential
Degree in Engineering, Materials Science, Physics or related discipline
Experience in semiconductor or RF module manufacturing environments
Hands-on experience with at least one of the following:
Silver epoxy die attach
Silver sintering
Eutectic die attach
Gold wire bonding
Strong understanding of materials behaviour and thermal management
Experience in process validation and statistical analysis
Proven problem-solving capability within a manufacturing setting Desirable
Background in high-precision electronics, automotive or power electronics manufacturing
Experience in high-tech or semiconductor production environments
Knowledge of RF packaging and JEDEC standards
Experience with equipment specification and commissioning
Familiarity with thermomechanical modelling and reliability testing
Understanding of ISO 9001 or IATF 16949 quality systems Key Attributes
Analytical, structured and detail-oriented approach
Strong cross-functional collaboration skills
Ability to translate technical requirements into practical manufacturing solutions
Hands-on and proactive within a production environment
Comfortable working across both development and operations
Capable of managing priorities in a fast-paced, scaling organisation