Are you passionate about driving integrated photonic technologies into innovative products? Then, leverage your experience to help us unlock the immense business potential of photonic integrated circuits (PIC) - a market that is growing rapidly due to the demand for AI, faster communication, and novel types of sensors. ZEISS has started a major strategic initiative to establish an interdisciplinary team in a dynamic and agile startup environment. The corporate-backed startup will benefit from ZEISS's ecosystem and its expertise in the field of photonics.
You will play a key role in the design and development of advanced photonic packaging solutions that enable the high performance and reliability of our PICs. You will create innovative packaging designs that meet the technical requirements of advanced photonic systems. In this exciting opportunity, you will contribute to the commercialization and scaling of next-generation photonic technologies.
- Ensure design-for-manufacturability principles are applied to the photonic packages to ensure scalability and cost-effectiveness
- Conduct thermal and stress evaluations of photonic packages to guaranteeadequate heat dissipation and mechanical integrity under diverseenvironmentalconditions.
- Design package structures that optimizeoptical alignment between the PICs, optical fibers, optical components and external devices such as lasers and detectors
- Establish high-precision alignment and assembly processes, outline test protocols to assess the performance and reliability of the packaging solutions, and interpret test data to drivefurtherimprovements.
- Collaborateclosely with photonic designers, engineers, process engineers, and manufacturing teams to enhance packaging solutions.
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