London (Hybrid)
My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.
Role Requirements:
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Lead the development of advanced semiconductor packaging solutions from concept through to production
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Design and optimise package, substrate and system-level integration for high-performance devices
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Work across package architecture, layout, simulation and product development activities
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Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions
Key Skills Required:
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Experience in semiconductor packaging or advanced electronic packaging
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Knowledge of package, substrate or PCB design and integration
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Experience using industry-standard package or PCB design tools
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Understanding of signal integrity, power integrity or high-speed design principles
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Experience working with multidisciplinary engineering teams throughout product development
If this sounds like you, please apply
Salary description
£130000.00 - £150000.00 per year