Are you an expert in IC design and integrated sensors? Do you want to give robots a human-like sense of touch?
Job DescriptionThis project aims to develop a sensor + readout IC system for revolutionary flexible electronic skin (Smart Skin) for advanced robotics. Deploying "smart skin" across a robot's entire chassis creates severe engineering challenges. Scaling up to thousands of tactile sensors typically results in massive wiring overhead, high latency, and vulnerability to environmental electromagnetic interference (EMI) and power supply noise. Your role will be to design integrated sensors and mixed‑signal readout ICs that fundamentally address these issues. We aim to develop novel circuit architectures—such as localized digitization, event‑driven/asynchronous readout, and high‑voltage/high‑noise‑immune topologies—to deliver a robust, ultra‑low‑latency, and high‑dynamic‑range tactile processing system.
Responsibilities- IC Architecture & Design: Design, simulate, and lay out low‑power mixed‑signal ICs (including low‑noise front‑ends, high‑resolution/energy‑efficient ADCs, and localized data processing/multiplexing) tailored for matrix sensor arrays.
- Sensor Co‑Integration: Collaborate with materials and sensor experts to integrate CMOS chips with flexible/stretchable tactile sensor arrays (capacitive, piezoelectric, or piezoresistive).
- Tape‑out & Characterization: Manage chip tape‑outs (e.g., TSMC, GlobalFoundries, or specialized high‑voltage/BCD processes if applicable) and conduct rigorous benchtop electrical characterization and robotic system‑level validation.
- Mentorship & Publication: Co‑supervise PhD/Master students and publish high‑impact papers in top‑tier solid‑state circuits and sensor journals/conferences (JSSC, ISSCC, TCAS, IEEE Sensors).
- Impact: Your work will directly influence the hardware architecture of future consumer electronics.
- Expertise: Work alongside a world‑class team with extensive experience in mixed‑signal IC design and audio systems.
- Facilities: Access to state‑of‑the‑art cleanrooms, high‑end measurement equipment (Audio Precision, high‑speed oscilloscopes), and advanced CMOS process nodes.
- Solid Foundation in Analog IC Design: Deep understanding of MOSFET physics, amplifiers, voltage references, and frequency compensation.
- Mixed‑Signal Design Experience: Proven experience in designing blocks such as ADCs/DACs, comparators, or oscillators. Familiarity with the interaction between digital control logic and analog power stages.
- System Modeling Skills: Proficiency in MATLAB/Simulink or Verilog‑A for top‑level architectural verification.
- Hands‑on EDA Experience: Expert‑level proficiency in Cadence Virtuoso (Spectre/APS), Mentor Graphics, or similar industry‑standard toolsets.
- Academic Excellence: A Master’s degree (or equivalent) in Electrical Engineering or Microelectronics with a focus on Integrated Circuits.
- Preferred but not mandatory: Prior experience in ultrasound sensors and readout ICs, capacitive/resistive sensor and readout ICs.
- Duration of contract is 18 months (Temporary).
- 36–40 hours per week.
- Salary and benefits are in accordance with the Collective Labour Agreement for Dutch Universities.
- An excellent pension scheme via the ABP.
- The possibility to compile an individual employment package every year.
- Discount with health insurers on supplemental packages.
- Flexible working week.
- Every year, 232 leave hours (at 38 hours). You can also sell or buy additional leave hours via the individual choice budget.
- Plenty of opportunities for education, training and courses.
- Partially paid parental leave.
- Attention for working healthy and energetically with the vitality program.
€3200 - €4000 monthly